Invention Grant
- Patent Title: Circuit board assembly
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Application No.: US15725588Application Date: 2017-10-05
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Publication No.: US10673160B2Publication Date: 2020-06-02
- Inventor: Ralf Baier , Claus Brendel , Udo Angermueller , Andy Mantey
- Applicant: Lear Corporation
- Applicant Address: US MI Southfield
- Assignee: Lear Corporation
- Current Assignee: Lear Corporation
- Current Assignee Address: US MI Southfield
- Agency: Fishman Stewart PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@303ad960
- Main IPC: H01R12/72
- IPC: H01R12/72 ; H01R12/58 ; H05K1/18 ; H01R12/70 ; H01R12/71 ; H05K1/05
Abstract:
The present disclosure includes a circuit board assembly that may include a circuit board that may include an aperture. The circuit board assembly may include a reverse header. The reverse header may include a base and a plurality of pins connected to the base. A portion of each of the plurality of pins may be disposed at least partially in the aperture. The circuit board may be configured an insulated metal substrate circuit board.
Public/Granted literature
- US20180102601A1 CIRCUIT BOARD ASSEMBLY Public/Granted day:2018-04-12
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