A terminal block in which outflow of a sealing portion made of a rubber-based adhesive can be suppressed even when exposed to a heated environment, and the sealing properties can be maintained. The terminal block includes a housing having a resin portion, a bus bar, and the sealing portion. The bus bar integrally includes an embedded portion embedded in the resin portion, and a connecting portion projecting outward from the resin portion. The sealing portion fills a gap between the embedded portion and the resin portion. The sealing portion is made of a rubber-based adhesive. The bus bar includes a base material made of Cu or a Cu alloy, and an Sn-based plated layer made of Sn or an Sn alloy and partially covering a surface of the base material. The base material is exposed at a sealing region in contact with the sealing portion.