An apparatus includes a sensor package, a housing, and one or more stitched terminals. The housing comprises a first cavity configured to receive the sensor package, a second cavity configured to receive an electrical connector, and a wall separating the cavities. The first cavity has a support surface located between a sensor receiving opening and the wall. The one or more stitched terminals are generally stitched into the wall, each having a sensor contact end extending into the first cavity and a connector contact end extending into the second cavity. At least one of the sensor package and the stitched terminals is positionable to align electrical contact pads of the sensor package with the sensor contact ends of the stitched terminals. The sensor package, when positioned between the support surface and the sensor contact ends of the stitched terminals, is essentially uncompressed.