Invention Grant
- Patent Title: Manufacturing method of connector structure
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Application No.: US16055160Application Date: 2018-08-06
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Publication No.: US10673194B2Publication Date: 2020-06-02
- Inventor: Yu-Hsiang Chuang , Guodong Li , He Lei , Jianyu Zhang
- Applicant: Unimicron Technology Corp.
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Taoyuan
- Agency: JCIPRNET
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3d20c0c
- Main IPC: H01R43/00
- IPC: H01R43/00 ; H01R12/55

Abstract:
A manufacturing method of connector structure including the following steps is provided. First, providing a dielectric layer having. Then, forming a first adhesive layer and a second adhesive layer on two opposite sides of the dielectric layer respectively. Then, providing at least one first conductive elastic cantilever and at least one second conductive elastic cantilever, wherein the first conductive elastic cantilever comprises a first fixing end portion and a first free end portion, and the second conductive elastic cantilever comprises a second fixing end portion and a second free end portion. Then, fixing the first fixing end portion and the second fixing end portion to the first adhesive layer and the second adhesive layer respectively, wherein the first fixing end portion is aligned with the second fixing end portion. Afterward, forming at least one conductive via for electrically connecting the first conductive elastic cantilever with the second conductive elastic cantilever.
Public/Granted literature
- US20200006906A1 MANUFACTURING METHOD OF CONNECTOR STRUCTURE Public/Granted day:2020-01-02
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