Invention Grant
- Patent Title: Power conversion device with efficient cooling structure
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Application No.: US16472062Application Date: 2017-11-07
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Publication No.: US10673349B2Publication Date: 2020-06-02
- Inventor: Youhei Nishizawa , Ayumu Hatanaka , Takeshi Seki
- Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Volpe and Koenig, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6d51753b
- International Application: PCT/JP2017/040033 WO 20171107
- International Announcement: WO2018/116667 WO 20180628
- Main IPC: H02M7/00
- IPC: H02M7/00 ; H05K7/02 ; H05K7/20 ; H01G17/00

Abstract:
To improve reliability of a power conversion device with an efficient cooling structure. A power conversion device according to the present invention includes a power semiconductor module configured to convert power, a first capacitor configured to smooth the power, a conductor section forming a first power path between a power terminal and the first capacitor and a second power path between the first capacitor and the power semiconductor module, a noise filter section including a second capacitor that smooths power having a higher frequency than a frequency of the power smoothed by the first capacitor, and a cooling section forming a cooling surface, and the noise filter section is connected to the conductor section forming the first power path, and the conductor section forming the first power path is arranged in a space between the cooling surface and the noise filter section.
Public/Granted literature
- US20200100377A1 POWER CONVERSION DEVICE Public/Granted day:2020-03-26
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