Invention Grant
- Patent Title: Method and apparatus for inductive coupling signal transmission
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Application No.: US16025867Application Date: 2018-07-02
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Publication No.: US10673490B2Publication Date: 2020-06-02
- Inventor: Ken Iwakura
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Dorsey & Whitney LLP
- Main IPC: H04B5/00
- IPC: H04B5/00 ; H01L25/11 ; H01L49/02 ; H01L23/64

Abstract:
Method and Apparatuses for of transmitting data between semiconductor chips are described. An example apparatus includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip includes first and second inductors. The first semiconductor chip transmits a first combination of a plurality of data bits in logical value by flowing a first current through the first inductor and by flowing substantially no current through the second inductor. The second semiconductor chip includes third and fourth inductors that correspond respectively to the first and second inductors of the first semiconductor chip. The second semiconductor chip receives the first combination of the plurality of data bits in logical value by detecting an electromotive force at the third inductor responsive to the first current and by detecting substantially no electromotive force at the fourth inductor responsive to no current.
Public/Granted literature
- US20180316393A1 METHOD AND APPARATUSES FOR INDUCTIVE COUPLING SIGNAL TRANSMISSION Public/Granted day:2018-11-01
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