Invention Grant
- Patent Title: Integrated circuit with radio frequency interconnect
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Application No.: US14921205Application Date: 2015-10-23
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Publication No.: US10673603B2Publication Date: 2020-06-02
- Inventor: Huan-Neng Chen , William Wu Shen , Chewn-Pu Jou , Feng Wei Kuo , Lan-Chou Cho , Tze-Chiang Huang , Jack Liu , Yun-Han Lee
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: H04L12/28
- IPC: H04L12/28 ; H04L5/14 ; H04W52/02

Abstract:
An integrated circuit includes a first radio frequency interconnect (RFI) transceiver, a second RFI transceiver, a third RFI transceiver, a fourth RFI transceiver and a guided transmission medium. The first RFI transceiver is configured to transmit or receive a first data signal. The second RFI transceiver is configured to transmit or receive a second data signal. The third RFI transceiver is configured to transmit or receive the first data signal. The fourth RFI transceiver is configured to transmit or receive the second data signal. The guided transmission medium is configured to carry the first data signal and the second data signal. The first RFI transceiver and the second RFI transceiver are connected to the third RFI transceiver and the fourth RFI transceiver by the guided transmission medium.
Public/Granted literature
- US20170117932A1 INTEGRATED CIRCUIT WITH RADIO FREQUENCY INTERCONNECT Public/Granted day:2017-04-27
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