Invention Grant
- Patent Title: High-speed full-duplex transceiver and method thereof
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Application No.: US16253343Application Date: 2019-01-22
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Publication No.: US10673606B1Publication Date: 2020-06-02
- Inventor: Chia-Liang (Leon) Lin
- Applicant: Realtek Semiconductor Corp.
- Applicant Address: TW Hsinchu
- Assignee: REALTEK SEMICONDUCTOR CORP.
- Current Assignee: REALTEK SEMICONDUCTOR CORP.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H04L5/14
- IPC: H04L5/14 ; H03F3/45 ; H03M1/12 ; H03M1/66

Abstract:
A transceiver includes a first digital-to-analog converter (DAC) configured to receive a first digital code and output a first current to a first node; a second DAC configured to receive a second digital code and output a second current to a second node; first and second shunt resistors configured to shunt the first node and second nodes to a DC (direct current) node; a first DC coupling resistor coupling the first node to a third node; a second DC coupling resistor coupling the second node to the third node; an AC (alternate current) coupling capacitor coupling the third node to a fourth node; a transimpedance amplifier configured to receive an input current from the fourth node and output an output current to a fifth node; an inductive load configured to shunt the fifth node to a DC node; and an analog-to-digital conversion unit configured to receive a voltage at the fifth node and output a third digital code.
Information query