The present invention relates to an over-ear headphones comprising a headband, two earpiece modules connected to two ends of the headband, a holder and an adjustable microphone. Each of the two earpiece modules comprises an elastic case, a fixing baffle connected to the elastic case, a speaker connected to the fixing baffle, a back cover, a LED light plate at a bottom of the hack cover, and two transparent plates at an outside of the back cover. The speaker comprises a plate, a T-bar, a magnetic element, a cushion ring, a diaphragm, a voice coil and a protection cap having plural first holes arranged in a cross pattern at a central thereof, plural second holes surrounding the plural first holes, and plural third, fourth and fifth holes sequentially and radially arranged thereon for surrounding the plural second holes.