Invention Grant
- Patent Title: Electronic component, electronic component manufacturing method, and mechanical component
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Application No.: US16237299Application Date: 2018-12-31
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Publication No.: US10674596B2Publication Date: 2020-06-02
- Inventor: Yuki Matsumoto
- Applicant: NEC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: NEC CORPORATION
- Current Assignee: NEC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@41b8cc50
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/34 ; H05K1/18
Abstract:
An electronic component includes a board on which a heat generating member is mounted, and a mechanical component that covers the upper side of the board and has an opening at a position corresponding to the heat generating member. The mechanical component has a connection part dissipating heat of the heat generating member to the mechanical component via the board, in the vicinity of the opening.
Public/Granted literature
- US20190230780A1 ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MANUFACTURING METHOD, AND MECHANICAL COMPONENT Public/Granted day:2019-07-25
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