Invention Grant
- Patent Title: Multilayer rigid flexible printed circuit board and method for manufacturing the same
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Application No.: US16794602Application Date: 2020-02-19
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Publication No.: US10674610B1Publication Date: 2020-06-02
- Inventor: Yang Je Lee , Dek Gin Yang , Dong Gi An , Jae Ho Shin
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@366811b2
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/06 ; H05K3/46 ; H05K1/09 ; H05K3/38 ; H05K3/00 ; H05K3/28
Abstract:
The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.
Public/Granted literature
- US20200187362A1 MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2020-06-11
Information query
