Invention Grant
- Patent Title: Semiconductor device and manufacturing method therefor, and resin composition for forming flexible resin layer
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Application No.: US15527644Application Date: 2015-11-16
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Publication No.: US10674612B2Publication Date: 2020-06-02
- Inventor: Tomoaki Shibata , Hanako Yori , Tomonori Minegishi , Hidenori Abe , Takashi Masuko , Shunsuke Otake
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4af696ab com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@77543eba com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7009b64c com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@ad79abc com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@74ea1683
- International Application: PCT/JP2015/082123 WO 20151116
- International Announcement: WO2016/080346 WO 20160526
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K3/28 ; H01L21/56 ; G01P1/12 ; H01L25/18 ; H01L23/31 ; H05K3/00 ; H05K1/18
Abstract:
Disclosed is a method for producing a semiconductor device including a circuit board having a flexible resin layer that encapsulates a circuit component. The method may include a step of immersing a flexible substrate in an encapsulant, drying the encapsulant, and thereby encapsulating the circuit component with the encapsulant; and a step of curing the encapsulant, and thereby forming a flexible resin layer.
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