A wiring substrate for electronic component inspection apparatus includes a first laminate which is formed by stacking a plurality of ceramic layers and which has a front surface and a back surface, and a plurality of studs joined to the back surface of the first laminate Each of the studs is composed of a flange portion which is circular in bottom view, and a bolt portion which perpendicularly extends from a center portion of an outside surface of the flange portion. The flange portion has a truncated conical shape and the outside surface from which the bolt portion protrudes, such that the outside surface slopes from the proximal end side of the bolt portion toward the peripheral edge of the flange portion and gradually approaches the inside surface of the flange portion.