Invention Grant
- Patent Title: Fan-less chiller-less liquid-air cooling for electronic racks of it components in data centers
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Application No.: US15526313Application Date: 2017-05-05
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Publication No.: US10674635B2Publication Date: 2020-06-02
- Inventor: Tianyi Gao , Yan Cui , Xiaogang Sun , Ali Heydari
- Applicant: Baidu USA LLC , Baidu.com Times Technology (Beijing) Co., Ltd.
- Applicant Address: US CA Sunnyvale CN Beijing
- Assignee: Baidu USA LLC,Baidu.com Times Technology (Beijing) Co., Ltd.
- Current Assignee: Baidu USA LLC,Baidu.com Times Technology (Beijing) Co., Ltd.
- Current Assignee Address: US CA Sunnyvale CN Beijing
- Agency: Womble Bond Dickinson (US) LLP
- International Application: PCT/CN2017/083152 WO 20170505
- International Announcement: WO2018/201425 WO 20181108
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A data center cooling system includes a housing to contain electronic racks of IT components operating therein, a coolant distribution unit (CDU) situated within the housing to control a liquid flow of a cooling liquid. One or more liquid cooling devices are disposed on the IT components to receive a first liquid from the CDU, to exchange or extract heat generated from the IT components, to transform the first liquid to a second liquid with a higher temperature, and to transmit the second liquid back to the CDU. The CDU is coupled to a heat transfer system to dissipate the exchanged heat to an external environment. The data center cooling system includes an airflow delivery system to generate a direct or indirect airflow to travel through the servers of the electronic racks to remove heat generated by the servers to the external environment eliminating chiller and IT fans.
Public/Granted literature
- US20180324976A1 FAN-LESS CHILLER-LESS LIQUID-AIR COOLING FOR ELECTRONIC RACKS OF IT COMPONENTS IN DATA CENTERS Public/Granted day:2018-11-08
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