Invention Grant
- Patent Title: Cooling device, cooling system, and cooling method for electronic circuitry
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Application No.: US16013184Application Date: 2018-06-20
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Publication No.: US10674637B2Publication Date: 2020-06-02
- Inventor: Minoru Ishinabe
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1f9b3e93
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A cooling device includes, a liquid immersion tank having an opening in a top thereof, in which an electronic circuitry including a heat generating circuit is immersed in a second coolant, a lid fitted into the opening, and a cooler, into which a cooled first coolant is input through a first pipe, and from which the first coolant is output through a second pipe, the cooler being located between a liquid level of the second coolant and a lower surface of the lid that faces the liquid level.
Public/Granted literature
- US20190008077A1 COOLING DEVICE, COOLING SYSTEM, AND COOLING METHOD FOR ELECTRONIC CIRCUITRY Public/Granted day:2019-01-03
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