• Patent Title: Cooling device, cooling system, and cooling method for electronic circuitry
  • Application No.: US16013184
    Application Date: 2018-06-20
  • Publication No.: US10674637B2
    Publication Date: 2020-06-02
  • Inventor: Minoru Ishinabe
  • Applicant: FUJITSU LIMITED
  • Applicant Address: JP Kawasaki
  • Assignee: FUJITSU LIMITED
  • Current Assignee: FUJITSU LIMITED
  • Current Assignee Address: JP Kawasaki
  • Agency: Fujitsu Patent Center
  • Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1f9b3e93
  • Main IPC: H05K7/20
  • IPC: H05K7/20
Cooling device, cooling system, and cooling method for electronic circuitry
Abstract:
A cooling device includes, a liquid immersion tank having an opening in a top thereof, in which an electronic circuitry including a heat generating circuit is immersed in a second coolant, a lid fitted into the opening, and a cooler, into which a cooled first coolant is input through a first pipe, and from which the first coolant is output through a second pipe, the cooler being located between a liquid level of the second coolant and a lower surface of the lid that faces the liquid level.
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