Invention Grant
- Patent Title: Compound for metal powder injection molding, metal powder molded body, method for producing sintered body, and sintered body
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Application No.: US15902338Application Date: 2018-02-22
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Publication No.: US10675682B2Publication Date: 2020-06-09
- Inventor: Hidefumi Nakamura , Yasutoshi Hideshima
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6eb90939
- Main IPC: B22F1/00
- IPC: B22F1/00 ; B22F3/22 ; B22F7/06 ; B22F3/10 ; B22F3/24 ; B22F9/02

Abstract:
A compound for metal powder injection molding includes secondary particles in which first metal particles are bound to one another, and a matrix region including a binder and second metal particles composed of the same constituent material as the first metal particles and having a smaller average particle diameter than the first metal particles. The constituent material of the first metal particles is any of an Fe-based alloy, an Ni-based alloy, and a Co-based alloy.
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