Invention Grant
- Patent Title: Aqueous primer composition for adhesive bonding and bonding method using the same
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Application No.: US15856997Application Date: 2017-12-28
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Publication No.: US10675843B2Publication Date: 2020-06-09
- Inventor: Yiqiang Zhao , Dalip Kumar Kohli
- Applicant: Cytec Industries Inc.
- Applicant Address: US NJ Princeton
- Assignee: Cytec Industries Inc.
- Current Assignee: Cytec Industries Inc.
- Current Assignee Address: US NJ Princeton
- Agent Thi Dang
- Main IPC: B32B15/092
- IPC: B32B15/092 ; C09D163/00 ; C08K3/04 ; B32B27/38 ; C09J5/02 ; C09J5/06

Abstract:
A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, at least one curing agent, a silane compound, a low amount of a carbon-based material in particulate form, and optional additives. The carbon-based material is selected from graphene, graphene oxide (GO), graphite, carbon with various structures in micron-scale or nanoscale size, and combination thereof.
Public/Granted literature
- US20180186124A1 AQUEOUS PRIMER COMPOSITION FOR ADHESIVE BONDING AND BONDING METHOD USING THE SAME Public/Granted day:2018-07-05
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