Invention Grant
- Patent Title: Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
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Application No.: US15737504Application Date: 2016-07-04
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Publication No.: US10676579B2Publication Date: 2020-06-09
- Inventor: Katsuya Tomizawa , Yoichi Takano , Meguru Ito , Eisuke Shiga
- Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2d82e3bd
- International Application: PCT/JP2016/069754 WO 20160704
- International Announcement: WO2017/006897 WO 20170112
- Main IPC: C08J5/24
- IPC: C08J5/24 ; B32B27/30 ; H05K1/03 ; C08L35/00 ; B32B5/00 ; C08F2/44 ; B32B15/082 ; C09D4/00 ; B32B27/00 ; B32B15/08 ; C08G61/10 ; H05K1/09
Abstract:
It is intended to provide a resin composition that serves as a raw material for a printed circuit board excellent in heat resistance after moisture absorption and is excellent in moldability. The resin composition of the present invention contains a maleimide compound, a silane compound having a carbon-carbon unsaturated bond and a hydrolyzable group or a hydroxy group, a silane compound having an epoxy skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.
Public/Granted literature
- US20180155514A1 RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD Public/Granted day:2018-06-07
Information query
