Invention Grant
- Patent Title: Polyamide resin composition
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Application No.: US16461463Application Date: 2017-11-24
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Publication No.: US10676616B2Publication Date: 2020-06-09
- Inventor: Nobuhiro Yoshimura , Kazuki Iwamura
- Applicant: TOYOBO CO., LTD.
- Applicant Address: JP Osaka
- Assignee: TOYOBO CO., LTD.
- Current Assignee: TOYOBO CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2664fb36
- International Application: PCT/JP2017/042186 WO 20171124
- International Announcement: WO2018/101163 WO 20180607
- Main IPC: C08L77/02
- IPC: C08L77/02 ; C08J5/04 ; C08L77/06

Abstract:
The polyamide resin composition according to the present invention contains a polyamide resin (A) wherein an average carbon number of an alkylene group between amide groups is 5 or less and a polyamide resin (B) wherein an average carbon number of an alkylene group between amide groups is more than 5, wherein a ratio by mass (A)/(B) of the polyamide resin (A) to the polyamide resin (B) is from 98/2 to 40/60, and wherein, to 100 parts by mass of a total amount of the polyamide resin (A) and the polyamide resin (B), 0.5 to 20 part(s) by mass of a metal cyanide salt of a composition formula (1) (Ax[M(CN)y]) is compounded.
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