- Patent Title: Package for light emitting device and method for packaging the same
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Application No.: US15582084Application Date: 2017-04-28
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Publication No.: US10677417B2Publication Date: 2020-06-09
- Inventor: Jun Seok Park
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@23aa5e88
- Main IPC: F21V5/04
- IPC: F21V5/04 ; G02B5/18 ; H01L25/075 ; H01L33/54 ; H01L33/58 ; H01L33/62 ; F21V29/70 ; F21K9/69 ; H05K1/05 ; F21Y115/10

Abstract:
There are provided a light emitting device package and a method for manufacturing the same. The light emitting device includes: a plurality of barriers provided above a metal circuit board; a plurality of light emitting devices placed in a space between the barriers; and a lens unit provided at an upper side of the barrier. Accordingly, the plurality of light emitting devices can be conveniently seated as a module format, and a luminance can be increased. Also, an efficiency of heat sink can be increase.
Public/Granted literature
- US20170234491A1 PACKAGE FOR LIGHT EMITTING DEVICE AND METHOD FOR PACKAGING THE SAME Public/Granted day:2017-08-17
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