Invention Grant
- Patent Title: Heat sink
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Application No.: US16779286Application Date: 2020-01-31
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Publication No.: US10677535B1Publication Date: 2020-06-09
- Inventor: Kenya Kawabata , Yasumi Sasaki , Yosuke Watanabe
- Applicant: FURUKAWA ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@68d6369d
- Main IPC: F28D15/00
- IPC: F28D15/00 ; F28D15/04 ; F28D15/02 ; H05K7/20

Abstract:
An object of the present disclosure is to provide a heat sink that can equalize heat input in a heat receiving portion and increase a volume of the heat receiving portion, prevent an increase in heat resistance in the heat receiving portion even when a heat generation amount from a heat-generating element increases, and exhibit excellent cooling performance with respect to a cooling target.There is provided a heat sink including: a heat transport member having a heat receiving portion thermally connected to a heat-generating element; a tube body connected to a heat insulating portion or a heat radiating portion of the heat transport member; and a heat radiation fin group which is thermally connected to the tube body and in which a plurality of heat radiation fins are arranged, in which the heat transport member has an integral internal space that communicates from the heat receiving portion to a connection portion with the tube body and is sealed with a working fluid, and the internal space of the heat transport member communicates with an internal space of the tube body.
Public/Granted literature
- US20200173731A1 HEAT SINK Public/Granted day:2020-06-04
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