Invention Grant
- Patent Title: Plate-type heat transport device
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Application No.: US15963774Application Date: 2018-04-26
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Publication No.: US10677539B2Publication Date: 2020-06-09
- Inventor: Atsunobu Nakamura , Takuroh Kamimura , Akinori Uchino
- Applicant: LENOVO (SINGAPORE) PTE. LTD.
- Applicant Address: SG Singapore
- Assignee: LENOVO (SINGAPORE) PTE LTD
- Current Assignee: LENOVO (SINGAPORE) PTE LTD
- Current Assignee Address: SG Singapore
- Agency: Russell Ng PLLC
- Agent Antony P. Ng
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6faeb490
- Main IPC: F28F3/12
- IPC: F28F3/12 ; H05K7/20 ; H01L23/427 ; H04M1/02 ; F28D15/02 ; G06F1/20

Abstract:
A plate-type heat transport device is provided. The plate-type heat transport device includes a metal plate having a meandering shape flow passage. The flow passage includes multiple linear channels and return channels. The linear channels extends in parallel to each other from a first end of the metal plate to a second end of the metal plate. The return channels are located in the first and second ends of the metal plate to allow the linear channels to communicate with each other. A first area of the metal plate associated with the linear channels is thinner than a second area of the metal plate associated with the return channels. The flow passage of the metal plate contains a hydraulic fluid.
Public/Granted literature
- US20180313615A1 PLATE-TYPE HEAT TRANSPORT DEVICE Public/Granted day:2018-11-01
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