Invention Grant
- Patent Title: Film thickness measuring apparatus
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Application No.: US16266123Application Date: 2019-02-04
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Publication No.: US10677585B2Publication Date: 2020-06-09
- Inventor: Yuichi Masumoto , Toru Jokaku , Nobuaki Yamanaka , Yosuke Nakanishi
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@a45de4a
- Main IPC: G01B11/06
- IPC: G01B11/06 ; H01L21/67 ; H01L21/66

Abstract:
An occurrence of a noise in a light receiver is suppressed, and an accuracy of measuring a film thickness is improved. A film thickness measuring apparatus includes: a stage being in contact with only an end portion of a substrate; a reflection suppressing unit located separately from the stage in a region surrounded by the stage; a light source; and a light receiver which a first light made up of light, which has been emitted from the light source, reflected on an upper surface of the measured film and a second light reflected on an upper surface of the substrate enter. The reflection suppressing unit is located separately from a lower surface of the substrate exposed to atmosphere, and suppresses a reflection of light, which enters the reflection suppressing unit from the light source, to the light receiver.
Public/Granted literature
- US20190310074A1 FILM THICKNESS MEASURING APPARATUS Public/Granted day:2019-10-10
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