Invention Grant
- Patent Title: Method of manufacturing sensing chip and sensing chip
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Application No.: US15558506Application Date: 2016-04-05
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Publication No.: US10677731B2Publication Date: 2020-06-09
- Inventor: Yukito Nakamura , Takatoshi Kaya , Tomonori Kaneko , Kosuke Nagae , Hiroshi Hirayama
- Applicant: KONICA MINOLTA, INC.
- Applicant Address: JP Tokyo
- Assignee: KONICA MINOLTA, INC.
- Current Assignee: KONICA MINOLTA, INC.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6f30b03b
- International Application: PCT/JP2016/061112 WO 20160405
- International Announcement: WO2016/170967 WO 20161027
- Main IPC: G01N21/64
- IPC: G01N21/64 ; G01N21/03 ; G01N33/543 ; G01N21/552
Abstract:
A first frame having a first through-hole is arranged on a support so that one opening of the first through-hole is closed. A liquid containing a capturer is fed into the first through-hole, and a capturer is immobilized on the support exposed in the first through-hole. After removing the liquid from the support, a second frame having the second through-hole is arranged on the support in the first through-hole so that one opening of the second through-hole is closed.
Public/Granted literature
- US20180080872A1 METHOD OF MANUFACTURING SENSING CHIP AND SENSING CHIP Public/Granted day:2018-03-22
Information query
