- Patent Title: Method for the ultrasonic microscopic measurement of semiconductor samples, computer program for the ultrasonic microscopic measurement of semiconductor samples, computer program product and ultrasound microscope
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Application No.: US15788717Application Date: 2017-10-19
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Publication No.: US10677760B2Publication Date: 2020-06-09
- Inventor: Helmut Appel
- Applicant: OSRAM OLED GMBH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OLED GMBH
- Current Assignee: OSRAM OLED GMBH
- Current Assignee Address: DE Regensburg
- Agency: MH2 Technology Law Group, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@50e670a7 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@659fa017
- Main IPC: G01N29/06
- IPC: G01N29/06 ; G01N29/44 ; G01N29/07 ; G01N29/265
Abstract:
Method for ultrasound microscopic measuring of semiconductor samples, computer program for ultrasound microscopic measuring of semiconductor samples, computer program product and ultrasound microscope. Inter alia, a method for the ultrasound microscopic measurement of semiconductor samples is provided, in which the time distances (Δt) between signals are compared with comparative time distances, which are determined by a known thickness of a layer of the sample.
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