New cooling control techniques suitable for use in the testing of devices are disclosed. The new cooling control techniques are an improvement over existing cooling control techniques because the new cooling control techniques utilize inputs that are more representative of actual thermal conditions experienced by a DUT (device under test) and/or are more representative of various other parameters, such as DUT power consumption/dissipation, during testing. Also, the new cooling control techniques offer flexibility with respect to the cooling control algorithm to employ for the DUT during testing.