Systems and methods for non-hermetic Semiconductor Optical Amplifier (SOA) integration on a Silicon photonic (SiP) chip using Complementary Metal-Oxide-Semiconductor (CMOS) processes include creating a trench for placement of the SOA, wherein the trench is between two Spot Size Converters (SSCs) located on the SiP chip outside of the trench; forming pedestals in the trench in one or more existing CMOS layers of the SiP chip to guide vertical alignment of the SOA with the SSCs during its placement; and depositing metallic traces and a solder pattern in the trench above the pedestals to enable the SOAs to electrically bond and rest on the pedestals during reflow.