Invention Grant
- Patent Title: Dynamic generation of layout adaptive packaging
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Application No.: US16192448Application Date: 2018-11-15
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Publication No.: US10678150B1Publication Date: 2020-06-09
- Inventor: Uwe Hollerbach , Thomas L. Laidig
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Agent Steven H. Versteeg
- Main IPC: G03F7/20
- IPC: G03F7/20 ; H01L21/027
Abstract:
Aspects of disclosure provide a method for attaching wiring connections to a component using both design and field measured data of the component to produce accurate wiring connections.
Public/Granted literature
- US20200159132A1 DYNAMIC GENERATION OF LAYOUT ADAPTIVE PACKAGING Public/Granted day:2020-05-21
Information query
IPC分类:
