Invention Grant
- Patent Title: Cell layout method and system for creating stacked 3D integrated circuit having two tiers
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Application No.: US15793413Application Date: 2017-10-25
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Publication No.: US10678987B2Publication Date: 2020-06-09
- Inventor: Sheng-Hsiung Chen , Fong-Yuan Chang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: G06F30/30
- IPC: G06F30/30 ; G06F30/392 ; G06F30/39 ; G06F111/20

Abstract:
A method is disclosed. The method includes: obtaining a circuit design including a plurality of 2D cells of a 2D cell library; partitioning the plurality of 2D cells of the circuit design into a first group assigned to a first tier and a second group assigned to a second tier; swapping the 2D cells assigned to the first tier with corresponding 3D cells of a first type 3D cell library respectively; and swapping the 2D cells assigned to the second tier with corresponding 3D cells of a second type 3D cell library respectively; wherein at least one of the obtaining, partitioning, and swapping is performed using a processor. An associated system is also disclosed.
Public/Granted literature
- US20190121929A1 CELL LAYOUT METHOD AND ASSOCIATED SYSTEM Public/Granted day:2019-04-25
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