Invention Grant
- Patent Title: Dual IC card
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Application No.: US16247325Application Date: 2019-01-14
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Publication No.: US10679117B2Publication Date: 2020-06-09
- Inventor: Tetsuya Tsukada , Shonosuke Mizoguchi , Eriko Hatakeyama
- Applicant: TOPPAN PRINTING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@168e6f7d com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2dbf395b com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@55866304
- Main IPC: G06K19/077
- IPC: G06K19/077

Abstract:
A dual IC card of the present invention includes: an IC module having a contact terminal portion contacting an external machine, a connecting coil configuring a contactless terminal portion by electromagnetic coupling, and an IC chip having a contact communication function and a contactless communication function; an antenna formed along a coil wiring path that defines an inductance and having a coupling coil portion electromagnetically coupling with the connecting coil of the IC module, a main coil portion formed along a coil wiring path that defines an inductance and connected to the coupling coil portion for performing contactless communication with the external machine, and a resistance-increasing portion provided in a section that forms the coil wiring path of at least one of the coupling coil portion and the main coil portion increase electrical resistance in the section; and a plate-like card body in which the antenna is arranged.
Public/Granted literature
- US20190147314A1 DUAL IC CARD Public/Granted day:2019-05-16
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