- Patent Title: Partial etched polyimide for non-conductive adhesive containment
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Application No.: US16214967Application Date: 2018-12-10
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Publication No.: US10679652B2Publication Date: 2020-06-09
- Inventor: Kuen Chee Ee , Sitthipong Footrakul , Thana Meesomphop
- Applicant: Magnecomp Corporation
- Applicant Address: US CA Murrieta
- Assignee: Magnecomp Corporation
- Current Assignee: Magnecomp Corporation
- Current Assignee Address: US CA Murrieta
- Agency: DLA Piper LLP (US)
- Main IPC: G11B5/48
- IPC: G11B5/48 ; G11B5/55 ; G11B5/31

Abstract:
Embodiments of an adhesive containment structure are provided herein. The suspension includes a base portion that includes a metal support layer, an insulation layer including an insulating material on the metal support layer, and a signal conductor layer. The suspension includes a gimbaled portion, a microactuator adhered to the support layer. The suspension also includes an adhesive containment structure, the adhesive containment structure includes a first portion of the insulating material, a second portion of the insulating material, and a third portion of the insulating material, the first and second portions of the insulating material being separated by a gap, and the third portion of the insulating material disposed within the gap. Adhesive is disposed within the gap of the adhesive containment structure, the adhesive adhering the microactuator to the third portion of the insulating material.
Public/Granted literature
- US20190198047A1 Partial Etched Polyimide For Non-Conductive Adhesive Containment Public/Granted day:2019-06-27
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