Invention Grant
- Patent Title: Coil component and power supply circuit unit
-
Application No.: US15495637Application Date: 2017-04-24
-
Publication No.: US10679785B2Publication Date: 2020-06-09
- Inventor: Akifumi Kamijima
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6b985528
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F17/00 ; H02M3/156 ; H02M3/155 ; H01F17/04 ; H01F27/29

Abstract:
Provided is a coil component including a coil portion that has at least one layer of ring-shaped planar coil portion including a coil-wound portion and an insulative resin layer which covers the periphery of the coil-wound portion within the same layer as the coil-wound portion, and an insulative resin layer overlapping the planar coil portion; and a covering portion that covers the coil portion. The insulative resin layer has a superimposing region overlapping a forming region of the planar coil portion and a protrusion region protruding from at least any one of an inner peripheral edge and an outer peripheral edge of the superimposing region, when viewed in the direction of overlapping the planar coil portion.
Public/Granted literature
- US20170316868A1 COIL COMPONENT AND POWER SUPPLY CIRCUIT UNIT Public/Granted day:2017-11-02
Information query