- Patent Title: Manufacturing method for forming a thin film between two terminals
-
Application No.: US16303689Application Date: 2017-05-17
-
Publication No.: US10679850B2Publication Date: 2020-06-09
- Inventor: Koji Kadono , Shinji Imaizumi
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2fd7c549
- International Application: PCT/JP2017/018560 WO 20170517
- International Announcement: WO2017/208826 WO 20171207
- Main IPC: C01B21/064
- IPC: C01B21/064 ; C01G39/06 ; C23C16/46 ; C23C16/52 ; C23C16/54 ; H01L21/02 ; H01L31/18 ; H01L33/00 ; H01L33/42 ; H01L21/285 ; C23C14/56

Abstract:
A thin-film manufacturing method, a thin-film manufacturing apparatus, a manufacturing method for a photoelectric conversion element, a manufacturing method for a logic circuit, a manufacturing method for a light-emitting element, and a manufacturing method for a light control element with which number-of-layers control and laminating and film-forming of different kinds of materials is described. A thin-film manufacturing method according to the present technology includes bringing an electrically conductive film-forming target into contact with a first terminal and a second terminal, heating a first region that is a region of the film-forming target between the first terminal and the second terminal by applying voltage between the first terminal and the second terminal, supplying a film-forming raw material to the first region; and forming a thin film in the first region by controlling reaction time such that a thin film having a desired number of layers is formed.
Public/Granted literature
Information query