Invention Grant
- Patent Title: Carrier tape system and methods of using carrier tape system
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Application No.: US16368299Application Date: 2019-03-28
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Publication No.: US10679877B2Publication Date: 2020-06-09
- Inventor: Tsung-Jen Liao , Pei-Haw Tsao , Tsui-Mei Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Seed IP Law Group LLP
- Main IPC: H05K13/02
- IPC: H05K13/02 ; B65H5/28 ; H01L21/67 ; H01L21/683 ; C09J7/20 ; H05K13/00 ; H05K13/04
Abstract:
The current disclosure describes carrier tape systems that include a carrier tape substrate and a cover tape. The carrier tape system includes a plurality of repetitive adhesion areas where the carrier tape substrate and cover tape are attached to each other and non-adhesion areas where the carrier tape substrate and cover tape are not attached to each other. Separating the cover tape and the carrier tape substrate at these repetitive adhesion and non-adhesion areas imparts a vibration to the cover tape which impedes or prevents semiconductor devices carried in pockets of the carrier tape substrate from adhering to adhesive on the cover tape.
Public/Granted literature
- US20200006098A1 CARRIER TAPE SYSTEM AND METHODS OF USING CARRIER TAPE SYSTEM Public/Granted day:2020-01-02
Information query
