Invention Grant
- Patent Title: Substrate processing apparatus
-
Application No.: US15936797Application Date: 2018-03-27
-
Publication No.: US10679878B2Publication Date: 2020-06-09
- Inventor: Kazunari Sakata
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@64f820d6
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677 ; H01L21/687
Abstract:
A substrate processing apparatus includes a substrate processing part configured to process a substrate under a vacuum atmosphere, a substrate transfer part connected to the substrate processing part and configured to transfer the substrate under an air atmosphere, and a load lock part disposed between the substrate processing part and the substrate transfer part and configured to switch between the air atmosphere and the vacuum atmosphere. At least a part of the load lock part is disposed inside the substrate transfer part.
Public/Granted literature
- US20180286716A1 Substrate Processing Apparatus Public/Granted day:2018-10-04
Information query
IPC分类:
