Invention Grant
- Patent Title: Stacked vertical devices
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Application No.: US15820772Application Date: 2017-11-22
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Publication No.: US10679904B2Publication Date: 2020-06-09
- Inventor: Effendi Leobandung
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent L. Jeffrey Kelly, Esq.
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L21/822 ; H01L27/088 ; H01L27/092 ; H01L21/8238 ; H01L27/06 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor structure containing a plurality of stacked vertical field effect transistor (FETs) is provided. After forming a first vertical FET of a first conductivity type at a lower portion of a semiconductor fin, a second vertical FET of a second conductivity type is formed on top of the first vertical FET. The second conductivity type can be opposite to, or the same as, the first conductivity type. A source/drain region of the first vertical FET is electrically connected to a source/drain region of the second vertical FET by a conductive strip structure.
Public/Granted literature
- US20180277442A1 STACKED VERTICAL DEVICES Public/Granted day:2018-09-27
Information query
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