Invention Grant
- Patent Title: Chip package structure, terminal device, and method
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Application No.: US16438918Application Date: 2019-06-12
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Publication No.: US10679917B2Publication Date: 2020-06-09
- Inventor: Yibao Zhou , Wenzhen Zhang
- Applicant: Guangdong Oppo Mobile Telecommunications Corp., Ltd.
- Applicant Address: CN Dongguan
- Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
- Current Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
- Current Assignee Address: CN Dongguan
- Agency: Young Basile Hanlon & MacFarlane, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@78580649
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/00 ; H01L21/56 ; H01L23/29 ; H01L23/488 ; G06K9/00 ; H01L27/146
Abstract:
A chip package apparatus is provided. The chip package apparatus includes a substrate, a chip on the substrate, and a filling layer on the substrate and surrounding a portion of the chip. The filling layer is made of epoxy molding compound (EMC) and the EMC is white. An electronic device with the chip package apparatus and a method for manufacturing the chip package apparatus are provided.
Public/Granted literature
- US20190295916A1 Chip Package Structure, Terminal Device, and Method Public/Granted day:2019-09-26
Information query
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