A semiconductor package device includes a leadframe, a first die and a package body. The leadframe includes a first die paddle and a lead. The first die paddle has a first surface and a second surface opposite to the first surface. The first die is disposed on the first surface of the first die paddle. The package body covers the first die and at least a portion of the first surface of the first die paddle and exposing the lead. The package body has a first surface and a second surface opposite to the first surface. The second surface of the package body is substantially coplanar with the second surface of the first die paddle. The lead extends from the second surface of the package body toward the first surface of the package body. A length of the lead is greater than a thickness of the package body.