Invention Grant
- Patent Title: Mask and metal wiring of a semiconductor device formed using the same
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Application No.: US15285631Application Date: 2016-10-05
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Publication No.: US10679940B2Publication Date: 2020-06-09
- Inventor: Jong-Seok Lim , Hyeun-Su Kim , Jung-Hoon Sung , Kweon-Jae Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@36e03665
- Main IPC: H01L23/528
- IPC: H01L23/528 ; G03F1/38 ; G03F1/60 ; H01L21/033 ; H01L21/768 ; H01L23/522

Abstract:
A mask including a mask substrate including a cell exposure region and a peripheral exposure region, the cell exposure region configured to expose a metal layer in a cell region of a semiconductor device, the peripheral exposure region configured to expose a metal layer in a peripheral region of the semiconductor device, a first mask pattern configured to expose the metal layer in the peripheral exposure region of the mask substrate to form a signal metal pattern, and a second mask pattern configured to expose the metal layer in the peripheral exposure region of the mask substrate to form a dummy metal pattern, the second mask pattern being adjacent to the first mask pattern, and the second mask pattern having a substantially same width as a width of the first mask pattern may be provided.
Public/Granted literature
- US20170098601A1 MASK AND METAL WIRING OF A SEMICONDUCTOR DEVICE FORMED USING THE SAME Public/Granted day:2017-04-06
Information query
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