Invention Grant
- Patent Title: Electrically conductive laminate structures
-
Application No.: US16388754Application Date: 2019-04-18
-
Publication No.: US10679943B2Publication Date: 2020-06-09
- Inventor: Gurtej S. Sandhu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L23/532
- IPC: H01L23/532 ; H01L21/768

Abstract:
Some embodiments include electrical interconnects. The interconnects may contain laminate structures having a graphene region sandwiched between non-graphene regions. In some embodiments the graphene and non-graphene regions may be nested within one another. In some embodiments an electrically insulative material may be over an upper surface of the laminate structure, and an opening may extend through the insulative material to a portion of the laminate structure. Electrically conductive material may be within the opening and in electrical contact with at least one of the non-graphene regions of the laminate structure. Some embodiments include methods of forming electrical interconnects in which non-graphene material and graphene are alternately formed within a trench to form nested non-graphene and graphene regions.
Public/Granted literature
- US20190244910A1 Electrically Conductive Laminate Structures Public/Granted day:2019-08-08
Information query
IPC分类: