Invention Grant
- Patent Title: Integrated circuit system with carrier construction configuration and method of manufacture thereof
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Application No.: US16117483Application Date: 2018-08-30
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Publication No.: US10679954B2Publication Date: 2020-06-09
- Inventor: David G. Love , Philip Eugene Rogren
- Applicant: EoPlex Limited
- Applicant Address: CN Hong Kong
- Assignee: EoPLex Limited
- Current Assignee: EoPLex Limited
- Current Assignee Address: CN Hong Kong
- Agency: Horizon IP PTE Ltd
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31
Abstract:
A method of manufacture of an integrated circuit system includes: providing a semiconductor wafer with a bond pad; attaching a detachable carrier to the semiconductor wafer, the detachable carrier including a carrier frame portion and a terminal structure; removing the carrier frame portion with the terminal structure attached to the semiconductor wafer; and forming an encapsulation encapsulating the semiconductor wafer, the bond pad, and the terminal structure.
Public/Granted literature
- US20180374809A1 INTEGRATED CIRCUIT SYSTEM WITH CARRIER CONSTRUCTION CONFIGURATION AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2018-12-27
Information query
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