Invention Grant
- Patent Title: Semiconductor package with heat-dissipating structure and method of manufacturing the same
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Application No.: US15788189Application Date: 2017-10-19
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Publication No.: US10679955B2Publication Date: 2020-06-09
- Inventor: Tae Hyun Kim , Thomas A. Kim , Kyu Bum Han
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5d6364df
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/13 ; H01L23/498 ; H01L23/00 ; H01L23/538 ; H01L25/10 ; H01L23/552 ; H01L25/03
Abstract:
A semiconductor package includes a substrate portion including a core layer having a device accommodating portion formed therein, and a buildup layer stacked on each of opposing sides of the core layer; an electronic device disposed in the device accommodating portion; and heat dissipating conductors disposed in the buildup layer to externally emit heat generated by the electronic device.
Public/Granted literature
- US20180197831A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-07-12
Information query
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