Invention Grant
- Patent Title: Semiconductor package structure with preferred heat dissipating efficacy without formation of short circuit
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Application No.: US15013881Application Date: 2016-02-02
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Publication No.: US10679965B2Publication Date: 2020-06-09
- Inventor: Chia-Wei Li , Yen-Ni Hu
- Applicant: ZOWIE Technology Corporation
- Applicant Address: TW New Taipei
- Assignee: ZOWIE TECHNOLOGY CORPORATION
- Current Assignee: ZOWIE TECHNOLOGY CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: Bacon & Thomas, PLLC
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/56 ; H01L21/78 ; H01L23/495 ; H01L23/31 ; H01L23/051
Abstract:
A semiconductor package structure and manufacturing method thereof are provided, and the semiconductor package structure includes a semiconductor element, a top substrate, a bottom substrate, an insulating layer, and two metal conductive layers. The top substrate is mainly made of a conductive metal, and having a first separated portion on the top substrate, the first separated portion divides the top substrate into two blocks which are not electrically connected to each other. The bottom substrate is mainly made of the conductive metal, and having a second separated portion on the bottom substrate. The second separated portion divides the bottom substrate into two blocks which are not electrically connected to each other. The insulating layer is disposed between the top substrate and the bottom substrate. The metal conductive layer is disposed at two sides of the insulating layer and connected to the top substrate and the bottom substrate. The semiconductor element is contacted with the top substrate and the bottom substrate.
Public/Granted literature
- US20160225684A1 Semiconductor Package Structure and Manufacturing Method Thereof Public/Granted day:2016-08-04
Information query
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