An electronic circuit device includes a first electronic component having a set of first terminals disposed at a first pitch on a first surface, and a second electronic component having a set of second terminals disposed at a second pitch on a second surface facing the first surface of the first electronic component. The second pitch of the second terminals is set larger than the first pitch of the first terminals. By doing so, each of the second terminals is connected to at least one of the first terminals if a positional misalignment occurs. As a result, the electronic circuit device has an increased tolerance for positional misalignment between the first electronic component and the second electronic component and reduces the occurrence of connection failure.