Invention Grant
- Patent Title: Semiconductor memory device of three-dimensional structure
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Application No.: US16041149Application Date: 2018-07-20
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Publication No.: US10680004B2Publication Date: 2020-06-09
- Inventor: Sung-Lae Oh , Dong-Hyuk Kim , Soo-Nam Jung
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5a4f0332
- Main IPC: H01L27/11551
- IPC: H01L27/11551 ; G11C5/06 ; H01L27/11578 ; G11C16/00 ; G11C7/18 ; G11C8/14

Abstract:
A semiconductor memory device comprises a memory cell array disposed on a substrate, a plurality of bit lines disposed on the a memory cell array, each bit line extending in a first direction parallel to the top surface of the substrate and divided into a first bit line section and a second bit line section, and a plurality of source line pads disposed at the same layer as the bit lines between the first bit line sections of the bit lines and the second bit line sections of the bit lines.
Public/Granted literature
- US20190237472A1 SEMICONDUCTOR MEMORY DEVICE OF THREE-DIMENSIONAL STRUCTURE Public/Granted day:2019-08-01
Information query
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