Invention Grant
- Patent Title: Solid-state imaging device
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Application No.: US16326060Application Date: 2018-07-25
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Publication No.: US10680028B2Publication Date: 2020-06-09
- Inventor: Kenji Kobayashi , Toshifumi Wakano , Yusuke Otake
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@33c9b51b
- International Application: PCT/JP2018/027845 WO 20180725
- International Announcement: WO2019/026719 WO 20190207
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L23/522 ; H01L31/107

Abstract:
An imaging device includes a first chip (12). The first chip includes a first pixel (21) and a second pixel (21). The first pixel includes a first anode region (31) and a first cathode region (32), and the second pixel includes a second anode region (31) and a second cathode region (32). The first chip includes a first wiring layer (23). The first wiring layer includes a first anode electrode (37), a first anode via (38) coupled to the first anode electrode (37) and the first anode region (31), and a second anode via (38) coupled to the first anode electrode (37) and the second anode region (31).
Public/Granted literature
- US20190181177A1 SOLID-STATE IMAGING DEVICE Public/Granted day:2019-06-13
Information query
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