A chip packaging method and a chip package are provided. According to the chip packaging method and the chip package, to-be-packaged chips are located in a plastic packaging layer, and front surfaces of the to-be-packaged chips are flush with a first surface of the plastic packaging layer, and the plastic packaging material for manufacturing the plastic packaging layer has good plasticity before a curing process, so that the formed first surface and the second surface have good smoothness, thereby ensuring the reliability of the package.