Invention Grant
- Patent Title: Semiconductor device including source/drain epitaxial layer having facets and manufacturing method thereof
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Application No.: US16426620Application Date: 2019-05-30
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Publication No.: US10680075B2Publication Date: 2020-06-09
- Inventor: Chao-Wei Hsu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L21/8234 ; H01L29/78 ; H01L29/66

Abstract:
A semiconductor device includes a fin structure disposed over a substrate, wherein the fin structure including a channel layer and extending in a first direction, a gate structure including a gate electrode layer and a gate dielectric layer, sidewall spacers disposed on opposite side faces of the gate structure, and a source/drain structure including an epitaxial layer having at least seven facets in a cross section along the first direction.
Public/Granted literature
Information query
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