Invention Grant
- Patent Title: Epitaxial structures for fin-like field effect transistors
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Application No.: US15962500Application Date: 2018-04-25
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Publication No.: US10680084B2Publication Date: 2020-06-09
- Inventor: Chia-Ta Yu , Sheng-Chen Wang , Feng-Cheng Yang , Yen-Ming Chen , Sai-Hooi Yeong
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/423 ; H01L29/78 ; H01L21/02 ; H01L21/8234 ; H01L21/8238 ; H01L27/12 ; H01L21/84

Abstract:
Epitaxial structures of a fin-like field effect transistor (FinFET) device includes a substrate, a fin structure including two fins, inner and outer fin spacers formed along both sidewalls of the fins, and isolation regions formed around the fins. The FinFET device further includes a gate structure formed over the fin structure and an epitaxial structure formed over the fin structure in a source/drain region. The epitaxial structure is formed by merging the fins with at least one epitaxial semiconductor layer and includes an air gap having a volume determined by the height and separation distance of the inner fin spacers.
Public/Granted literature
- US20190148528A1 Epitaxial Structures for Fin-Like Field Effect Transistors Public/Granted day:2019-05-16
Information query
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