Invention Grant
- Patent Title: Radio frequency silicon-on-insulator integrated heterojunction bipolar transistor
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Application No.: US16011430Application Date: 2018-06-18
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Publication No.: US10680086B2Publication Date: 2020-06-09
- Inventor: Sinan Goktepeli , George Pete Imthurn , Stephen Alan Fanelli
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Seyfarth Shaw LLP
- Main IPC: H01L29/737
- IPC: H01L29/737 ; H01L29/08 ; H01L29/10 ; H01L29/417 ; H01L29/66

Abstract:
A heterojunction bipolar transistor is integrated on radio frequency (RF) dies of different sizes. The heterojunction bipolar transistor includes an emitter on a first-side of a semiconductor-on-insulator (SOI) layer of an SOI substrate. The emitter is accessed from the first-side while a collector is accessed from a second-side of the SOI substrate. One or more portions of a base of the heterojunction bipolar transistor is between the emitter and one or more portions of the collector. The heterojunction bipolar transistor also includes a compound semiconductor layer between the collector and the emitter. The compound semiconductor layer carries a charge between the emitter and the collector.
Public/Granted literature
- US20190386121A1 RADIO FREQUENCY SILICON-ON-INSULATOR INTEGRATED HETEROJUNCTION BIPOLAR TRANSISTOR Public/Granted day:2019-12-19
Information query
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